Invention Grant
- Patent Title: Antenna device
- Patent Title (中): 天线设备
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Application No.: US13407070Application Date: 2012-02-28
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Publication No.: US08810475B2Publication Date: 2014-08-19
- Inventor: Tadahiko Maeda , Masataka Ito , Dongdong Wang , Yoshitsugu Wakazono , Yasuhiko Mano
- Applicant: Tadahiko Maeda , Masataka Ito , Dongdong Wang , Yoshitsugu Wakazono , Yasuhiko Mano
- Applicant Address: JP Ogaki-shi US CA Torrance JP Kyoto-shi
- Assignee: Ibiden Co., Ltd.,Ibiden USA R&D Inc.,The Ritsumeikan Trust
- Current Assignee: Ibiden Co., Ltd.,Ibiden USA R&D Inc.,The Ritsumeikan Trust
- Current Assignee Address: JP Ogaki-shi US CA Torrance JP Kyoto-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01Q1/36
- IPC: H01Q1/36 ; H01Q1/38

Abstract:
An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate.
Public/Granted literature
- US20120229342A1 ANTENNA DEVICE Public/Granted day:2012-09-13
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