Invention Grant
US08810772B2 Position detector, position detection method, exposure apparatus, and method of manufacturing device to align wafer by adjusting optical member
有权
位置检测器,位置检测方法,曝光装置以及通过调整光学构件对准晶片的装置的制造方法
- Patent Title: Position detector, position detection method, exposure apparatus, and method of manufacturing device to align wafer by adjusting optical member
- Patent Title (中): 位置检测器,位置检测方法,曝光装置以及通过调整光学构件对准晶片的装置的制造方法
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Application No.: US12261145Application Date: 2008-10-30
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Publication No.: US08810772B2Publication Date: 2014-08-19
- Inventor: Hironori Maeda
- Applicant: Hironori Maeda
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Division
- Priority: JP2007-286686 20071102
- Main IPC: G03B27/68
- IPC: G03B27/68

Abstract:
A position detector (16), configured to detect a position of a mark on an object to be detected, comprises an image pickup unit (34), an optical system, a noise obtaining unit (36) and a correction unit (38). The image pickup unit picks up an image of the object to be detected. The optical system forms an image of the object to be detected on an image pickup surface of the image pickup unit. The noise obtaining unit obtains noise information by picking up an image of a region other than the mark using the optical system and the image pickup unit in accordance with the result of adjustment of an optical member included in the optical system. The correction unit corrects, using the noise information obtained by the noise obtaining unit, the image of the mark obtained using the optical system and the image pickup unit.
Public/Granted literature
- US20090115985A1 POSITION DETECTOR, POSITION DETECTION METHOD, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE Public/Granted day:2009-05-07
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