Invention Grant
- Patent Title: Suspension substrate, suspension, suspension with head, hard disk drive, and method of manufacturing suspension substrate
- Patent Title (中): 悬挂基板，悬架，悬挂头，硬盘驱动器及制造悬架基板的方法
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Application No.: US13880410Application Date: 2011-11-02
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Publication No.: US08810969B2Publication Date: 2014-08-19
- Inventor: Jin Nishiyama , Yuji Narita , Hiroki Furushou
- Applicant: Jin Nishiyama , Yuji Narita , Hiroki Furushou
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2010-246526 20101102
- International Application: PCT/JP2011/075299 WO 20111102
- International Announcement: WO2012/060411 WO 20120510
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1−T2
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