Invention Grant
US08810970B2 Suspension substrate, suspension, and manufacturing method of suspension substrate
有权
悬浮基材悬浮液，悬浮液和悬浮液的制造方法
- Patent Title: Suspension substrate, suspension, and manufacturing method of suspension substrate
- Patent Title (中): 悬浮基材悬浮液，悬浮液和悬浮液的制造方法
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Application No.: US14153321Application Date: 2014-01-13
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Publication No.: US08810970B2Publication Date: 2014-08-19
- Inventor: Masao Ohnuki
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2010-195929 20100901
- Main IPC: G11B5/48
- IPC: G11B5/48 ; H05K1/00 ; H05K1/05 ; H05K1/18 ; H05K1/11 ; G11B5/00
Abstract:
A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.
Public/Granted literature
- US20140126086A1 SUSPENSION SUBSTRATE, SUSPENSION, AND MANUFACTURING METHOD OF SUSPENSION SUBSTRATE Public/Granted day:2014-05-08
Information query
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