Invention Grant
- Patent Title: Defect inspection method and device thereof
- Patent Title (中): 缺陷检查方法及其装置
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Application No.: US13141375Application Date: 2009-10-22
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Publication No.: US08811712B2Publication Date: 2014-08-19
- Inventor: Shunji Maeda , Kaoru Sakai , Hidetoshi Nishiyama
- Applicant: Shunji Maeda , Kaoru Sakai , Hidetoshi Nishiyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-330894 20081225
- International Application: PCT/JP2009/005561 WO 20091022
- International Announcement: WO2010/073453 WO 20100701
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
The invention provides a defect inspection method and a defect inspection device which enable a defect to be inspected regardless of optical conditions. The invention comprises the steps of setting a target local region and a plurality of corresponding local regions in the image signals, the target local region including a target pixel and an area surrounding the target pixel, the corresponding local regions including pixels corresponding to the target pixel and areas surrounding the corresponding pixels; searching similarities between the image signal of the target local region and the image signals of the plurality of corresponding local regions; determining a plurality of image signals that represent corresponding local regions and are similar to the image signal of the target local region; and comparing the image signal of the target local region with the image signals that represent the corresponding local regions.
Public/Granted literature
- US20110274342A1 DEFECT INSPECTION METHOD AND DEVICE THEREOF Public/Granted day:2011-11-10
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