Invention Grant
- Patent Title: Semiconductor manufacturing process modules
- Patent Title (中): 半导体制造工艺模块
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Application No.: US11876869Application Date: 2007-10-23
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Publication No.: US08812150B2Publication Date: 2014-08-19
- Inventor: Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
- Applicant: Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: G06F7/00
- IPC: G06F7/00
Abstract:
A method is provided. The method includes disposing a plurality of robotic facilities to form a semiconductor handling system, controlling the semiconductor handling system with a controller to handoff a workpiece between neighboring robotic facilities, and providing a software interface for the controller, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
Public/Granted literature
- US20080219808A1 SEMICONDUCTOR MANUFACTURING PROCESS MODULES Public/Granted day:2008-09-11
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