Invention Grant
- Patent Title: Vacuum process device and vacuum process method
- Patent Title (中): 真空工艺装置和真空工艺方法
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Application No.: US13479518Application Date: 2012-05-24
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Publication No.: US08812151B2Publication Date: 2014-08-19
- Inventor: Teruo Nakata , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
- Applicant: Teruo Nakata , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2011-117755 20110526
- Main IPC: G06F7/00
- IPC: G06F7/00 ; G06F19/00

Abstract:
An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.
Public/Granted literature
- US20120303158A1 VACUUM PROCESS DEVICE AND VACUUM PROCESS METHOD Public/Granted day:2012-11-29
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