Invention Grant
- Patent Title: Cooling circuit design
- Patent Title (中): 冷却回路设计
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Application No.: US13223451Application Date: 2011-09-01
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Publication No.: US08812270B2Publication Date: 2014-08-19
- Inventor: Zhi Li , Jingmei Wang
- Applicant: Zhi Li , Jingmei Wang
- Applicant Address: US TX Plano
- Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee Address: US TX Plano
- Main IPC: G06F17/50
- IPC: G06F17/50 ; B29C33/38 ; B29C33/04

Abstract:
Methods for computer-aided design and corresponding systems and computer-readable mediums. A method includes receiving a CAD model including a plurality of intersecting fluid channels, and determining a fluid inlet for the fluid channels. The method includes displaying possible fluid flow directions at an intersection of fluid channels. The method includes automatically adding a cooling fitting to at least one of the fluid channels of the CAD model in response to a user selection of one of the possible fluid flow directions.
Public/Granted literature
- US20130060529A1 COOLING CIRCUIT DESIGN Public/Granted day:2013-03-07
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