Invention Grant
US08812764B2 Apparatus installing devices controlled by MDIO or SPI protocol and method to control the same
有权
仪器安装由MDIO或SPI协议控制的设备及方法进行控制
- Patent Title: Apparatus installing devices controlled by MDIO or SPI protocol and method to control the same
- Patent Title (中): 仪器安装由MDIO或SPI协议控制的设备及方法进行控制
-
Application No.: US13284618Application Date: 2011-10-28
-
Publication No.: US08812764B2Publication Date: 2014-08-19
- Inventor: Ryutaro Futami
- Applicant: Ryutaro Futami
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors, LLP
- Main IPC: G06F13/36
- IPC: G06F13/36
Abstract:
An apparatus including a plurality of internal devices that communicates concurrently with a controller by one of the MDIO protocol and the SPI protocol is disclosed. The controller of the invention couples with respective devices by the point-to-point arrangement. The controller couples with the external apparatus by the MDIO protocol and receives a packet containing an address of one of internal devices, the controller communicates with the device defined by the address by the protocol attributed to the device.
Public/Granted literature
- US20130111085A1 APPARATUS INSTALLING DEVICES CONTROLLED BY MDIO OR SPI PROTOCOL AND METHOD TO CONTROL THE SAME Public/Granted day:2013-05-02
Information query
