Invention Grant
US08812773B2 Method of merging blocks in a semiconductor memory device, and semiconductor memory device to perform a method of merging blocks
有权
在半导体存储器件中合并块的方法以及半导体存储器件来执行合并块的方法
- Patent Title: Method of merging blocks in a semiconductor memory device, and semiconductor memory device to perform a method of merging blocks
- Patent Title (中): 在半导体存储器件中合并块的方法以及半导体存储器件来执行合并块的方法
-
Application No.: US13114262Application Date: 2011-05-24
-
Publication No.: US08812773B2Publication Date: 2014-08-19
- Inventor: Min-Seok Kim , Ki-Tae Park
- Applicant: Min-Seok Kim , Ki-Tae Park
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2010-0048367 20100525
- Main IPC: G06F12/00
- IPC: G06F12/00

Abstract:
In a method of merging blocks in a semiconductor memory device according to example embodiments, a plurality of data are written into one or more first blocks using a first program method. One or more merge target blocks that are required to be merged are selected among the one or more first blocks. A merge-performing block for a block merge operation is selected among the one or more first blocks and one or more second blocks. A plurality of merge target data are written from the merge target blocks into the merge-performing block using a second program method that is different from the first program method.
Public/Granted literature
Information query