Invention Grant
- Patent Title: Improvements of long term bondline reliability of power electronics operating at high temperatures
- Patent Title (中): 电力电子在高温下运行的长期保护层可靠性的改进
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Application No.: US13723055Application Date: 2012-12-20
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Publication No.: US08814030B2Publication Date: 2014-08-26
- Inventor: Sang Won Yoon
- Applicant: Sang Won Yoon
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Snell & Wilmer LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K20/16
Abstract:
Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
Public/Granted literature
- US20130270327A1 IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS OPERATING AT HIGH TEMPERATURES Public/Granted day:2013-10-17
Information query
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