Invention Grant
US08814298B2 Semiconductor device, method of manufacturing semiconductor device, and liquid discharge apparatus
有权
半导体装置,半导体装置的制造方法以及液体排出装置
- Patent Title: Semiconductor device, method of manufacturing semiconductor device, and liquid discharge apparatus
- Patent Title (中): 半导体装置,半导体装置的制造方法以及液体排出装置
-
Application No.: US13889630Application Date: 2013-05-08
-
Publication No.: US08814298B2Publication Date: 2014-08-26
- Inventor: Satoshi Suzuki , Noboyuki Suzuki , Masanobu Ohmura
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-121388 20120528
- Main IPC: B41J29/38
- IPC: B41J29/38 ; H01L29/78 ; H01L29/66 ; H01L29/786 ; H01L21/82

Abstract:
A semiconductor device includes a first conductivity type well region formed by counter doping; a transistor having source and drain regions having a second conductivity type, at least one of the regions being arranged in the well region; a LOCOS region arranged around the at least one region in the well region; and a channel stop region having the first conductivity type arranged under the LOCOS region. The at least one region is arranged at a distance from a tip of a bird's beak of the LOCOS in a direction parallel to a channel width of the transistor. The channel stop region is arranged at a distance from the tip of the bird's beak at an opposite side to the at least one region.
Public/Granted literature
- US20130314463A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND LIQUID DISCHARGE APPARATUS Public/Granted day:2013-11-28
Information query
IPC分类: