Invention Grant
- Patent Title: Liquid ejection head and method of manufacturing the same
- Patent Title (中): 液体喷射头及其制造方法
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Application No.: US13711435Application Date: 2012-12-11
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Publication No.: US08814317B2Publication Date: 2014-08-26
- Inventor: Takanori Enomoto
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: WOPCT/JP2011/078744 20111213
- Main IPC: B41J2/015
- IPC: B41J2/015 ; B23P17/00 ; B41J2/04
Abstract:
Provided is a liquid ejection head formed by performing bonding and fixing operations speedily and highly accurately when a recording element board is bonded to a supporting member, the liquid ejection head having a high liquid-landing accuracy and achieving a high printing quality. A method of manufacturing the liquid ejection head is also provided.Heat is conducted from a holding member, which supports the recording element board, to a thermosetting adhesive via the supporting member, which supports the recording element board, in order to accelerate the curing of the adhesive.
Public/Granted literature
- US20130194342A1 LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-08-01
Information query
IPC分类:
