An LED package structure is disclosed, which comprises an LED chip and a frame for receiving the LED chip, and the frame comprises a bottom wall, a first sidewall and a light exiting wall. The LED chip is disposed on the bottom wall, the first sidewall is obliquely disposed in a light exiting direction of the LED chip, and light rays emitted from the LED chip are reflected by the first sidewall and then exit from the light exiting wall. An LCD device is further disclosed. According to the LCD device and the LED package structure thereof of the present disclosure, light rays emitted from the LED chip are reflected by the first sidewall and then exit from the light exiting wall. This can increase the light mixing distance for the LED chip and avoid occurrence of light emission blind areas, thus eliminating the hot spot phenomenon.