A temperature sensor is described that comprises a temperature sensing element, a substantially thermally insulating substrate having a first side and a second side and at least one layer of substantially thermally conductive material coated on the first side of the substrate. A first hole is provided on the second side of the substrate and the temperature sensing element is arranged to sense temperature within the first hole. A plurality of additional holes may also be provided on the second side of the substrate, these holes may be coated to aid thermal transfer. The temperature sensing element may be a thermocouple. The temperature sensor may be included in a temperature measurement probe for use in measuring the temperature of workpieces produced using a machine tool.