Invention Grant
- Patent Title: Substrate processing apparatus and semiconductor device manufacturing method
- Patent Title (中): 基板加工装置及半导体装置的制造方法
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Application No.: US12078513Application Date: 2008-04-01
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Publication No.: US08814488B2Publication Date: 2014-08-26
- Inventor: Yukinori Aburatani
- Applicant: Yukinori Aburatani
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2007-096933 20070402; JP2008-060765 20080311
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A substrate processing apparatus comprises a storage container for storing multiple substrates and whose substrate loading and unloading opening is sealed by a lid, a load port for placing the storage container, an attaching and detaching device for attaching and detaching the lid on the substrate loading and unloading opening in the load port, a first placement unit for mounting the storage container in the load port and moving away from and near the attaching and detaching device, and a second placement unit provided separately from the first placement unit, for mounting the storage container in the load port and moving up and down relative to the attaching and detaching device.
Public/Granted literature
- US20080260502A1 Substrate processing apparatus and semiconductor device manufacturing method Public/Granted day:2008-10-23
Information query
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