Invention Grant
- Patent Title: Electric connecting structure between substrate and electric component and method of connection between substrate and electric component
- Patent Title (中): 基板与电气部件之间的电连接结构以及基板和电气部件之间的连接方法
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Application No.: US13712915Application Date: 2012-12-12
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Publication No.: US08814577B2Publication Date: 2014-08-26
- Inventor: Shigemitsu Nohira , Yuta Umemura
- Applicant: Advics Co., Ltd.
- Applicant Address: JP Kariya, Aichi-Pref.
- Assignee: Advics Co., Ltd.
- Current Assignee: Advics Co., Ltd.
- Current Assignee Address: JP Kariya, Aichi-Pref.
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2011-271140 20111212; JP2012-163454 20120724
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electric connecting structure between a substrate and an electric component includes a substrate mounted in a case, an electric component assembled to a member which the case is mounted, a bus bar fixed to the case and connected to an electric circuit on the substrate at its one end and a spring disposed in compressed state between the bus bar and an electrode formed on the electric component. The substrate is electrical lyconnected to the electric component through the bus bar and the spring and a held portion formed on the spring is held by a spring holding portion integrally formed on the bus bar.
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