Invention Grant
- Patent Title: Connecting element for data lines
- Patent Title (中): 数据线连接元件
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Application No.: US13530862Application Date: 2012-06-22
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Publication No.: US08814593B2Publication Date: 2014-08-26
- Inventor: Lieven Decrock , Rutger Wilhelmus Smink
- Applicant: Lieven Decrock , Rutger Wilhelmus Smink
- Applicant Address: BE Oostkamp NL 'S-Hertogenbosch
- Assignee: Tyco Electronics Belgium EC BVBA,TE Connectivity Nederland B.V.
- Current Assignee: Tyco Electronics Belgium EC BVBA,TE Connectivity Nederland B.V.
- Current Assignee Address: BE Oostkamp NL 'S-Hertogenbosch
- Agency: Faegre Baker Daniels LLP
- Priority: EP11171933 20110629
- Main IPC: H01R13/648
- IPC: H01R13/648
Abstract:
Connecting element for data lines with a body with a receiving section with recesses for receiving wires of the data lines, whereby electrical conductors are disposed on the body, whereby the conductors are guided from the recesses to a contact area, whereby the electronic circuit is connected with the conductors, whereby the element is made of molded material.
Public/Granted literature
- US20130005183A1 CONNECTING ELEMENT FOR DATA LINES Public/Granted day:2013-01-03
Information query
