Invention Grant
- Patent Title: Tracking spectrum features in two dimensions for endpoint detection
- Patent Title (中): 用于端点检测的二维跟踪光谱特征
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Application No.: US13187220Application Date: 2011-07-20
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Publication No.: US08814631B2Publication Date: 2014-08-26
- Inventor: Jeffrey Drue David , Xiaoyuan Hu , Zhize Zhu , Harry Q. Lee
- Applicant: Jeffrey Drue David , Xiaoyuan Hu , Zhize Zhu , Harry Q. Lee
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B49/00 ; B24B51/00
Abstract:
A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, determining a location value and an associated intensity value of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of coordinates, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of coordinates. At least some of the spectra of the sequence differ due to material being removed during the polishing, and the coordinates are pairs of location values and associated intensity values.
Public/Granted literature
- US20120021672A1 Tracking Spectrum Features In Two Dimensions For Endpoint Detection Public/Granted day:2012-01-26
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