Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US11853231Application Date: 2007-09-11
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Publication No.: US08815048B2Publication Date: 2014-08-26
- Inventor: Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
- Applicant: Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2006-251637 20060915; JP2006-327938 20061205; JP2006-328648 20061205
- Main IPC: H01L21/461
- IPC: H01L21/461 ; B08B3/04
Abstract:
A substrate processing apparatus has a cup part for receiving processing liquid which is applied from a processing liquid applying part and is splashed from a substrate, and the cup part is formed of electrical insulation material. Hydrophilic treatment is performed on an outer annular surface of the cup part and water is held on the outer annular surface of the cup part while processing the substrate. With this structure, charged potential of the cup part generated in splashing of pure water can be suppressed by the water held on the outer annular surface, without greatly increasing the manufacturing cost of the substrate processing apparatus by forming the cup part with special conductive material. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.
Public/Granted literature
- US20080070418A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2008-03-20
Information query
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