Invention Grant
- Patent Title: Microelectrode array architecture
- Patent Title (中): 微电极阵列架构
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Application No.: US13029140Application Date: 2011-02-17
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Publication No.: US08815070B2Publication Date: 2014-08-26
- Inventor: Gary Chorng-Jyh Wang , Ching Yen Ho , Wen Jang Hwang , Wilson Wen-Fu Wang
- Applicant: Gary Chorng-Jyh Wang , Ching Yen Ho , Wen Jang Hwang , Wilson Wen-Fu Wang
- Applicant Address: US CA San Jose
- Assignee: Sparkle Power, Inc.
- Current Assignee: Sparkle Power, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Arch Eqvity Holdings, LLC
- Agent Grace Lee Huang
- Main IPC: B01J8/00
- IPC: B01J8/00 ; B01L3/00

Abstract:
Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.
Public/Granted literature
- US20110247934A1 MICROELECTRODE ARRAY ARCHITECTURE Public/Granted day:2011-10-13
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