Invention Grant
- Patent Title: Connecting and bonding adjacent layers with nanostructures
- Patent Title (中): 用纳米结构连接和粘合相邻层
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Application No.: US13570634Application Date: 2012-08-09
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Publication No.: US08815332B2Publication Date: 2014-08-26
- Inventor: Mohammad Shafiqul Kabir , Andrzej Brud
- Applicant: Mohammad Shafiqul Kabir , Andrzej Brud
- Applicant Address: SE Göteborg
- Assignee: Smoltek AB
- Current Assignee: Smoltek AB
- Current Assignee Address: SE Göteborg
- Agency: Fish & Richardson P.C.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; B05D5/12
Abstract:
An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.
Public/Granted literature
- US20120301607A1 Connecting and Bonding Adjacent Layers with Nanostructures Public/Granted day:2012-11-29
Information query
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