Invention Grant
- Patent Title: Light-emitting diode on a conductive substrate
- Patent Title (中): 导电基板上的发光二极管
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Application No.: US12541787Application Date: 2009-08-14
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Publication No.: US08815618B2Publication Date: 2014-08-26
- Inventor: Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
- Applicant: Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
- Applicant Address: TW Hsin-Chu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/78
Abstract:
A light-emitting diode (LED) device is provided. The LED device is formed by forming an LED structure on a first substrate. A portion of the first substrate is converted to a porous layer, and a conductive substrate is formed over the LED structure on an opposing surface from the first substrate. The first substrate is detached from the LED structure along the porous layer and any remaining materials are removed from the LED structure.
Public/Granted literature
- US20100055818A1 Light-Emitting Diode on a Conductive Substrate Public/Granted day:2010-03-04
Information query
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