Invention Grant
- Patent Title: Chip package and a method for manufacturing a chip package
- Patent Title (中): 芯片封装和芯片封装的制造方法
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Application No.: US13602349Application Date: 2012-09-04
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Publication No.: US08815647B2Publication Date: 2014-08-26
- Inventor: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
- Applicant: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34
Abstract:
A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.
Public/Granted literature
- US20140061669A1 CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE Public/Granted day:2014-03-06
Information query
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