Invention Grant
- Patent Title: Integrated circuit packaging system with formed under-fill and method of manufacture thereof
- Patent Title (中): 集成电路封装系统及其制造方法
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Application No.: US13242656Application Date: 2011-09-23
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Publication No.: US08815650B2Publication Date: 2014-08-26
- Inventor: Reza Argenty Pagaila
- Applicant: Reza Argenty Pagaila
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate with an interconnect directly connecting between the substrate and the integrated circuit; and forming an under-fill between the integrated circuit and the substrate having a cast side.
Public/Granted literature
- US20130214430A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FORMED UNDER-FILL AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-08-22
Information query
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