Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same and semiconductor manufacturing device
- Patent Title (中): 半导体装置及其制造方法以及半导体制造装置
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Application No.: US12130577Application Date: 2008-05-30
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Publication No.: US08815652B2Publication Date: 2014-08-26
- Inventor: Fumihiko Inoue , Kentaro Sera
- Applicant: Fumihiko Inoue , Kentaro Sera
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Priority: JP2007-151619 20070607
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L27/112 ; G11C17/10
Abstract:
The present invention is a manufacturing method for a semiconductor device having steps of; aligning a program head 80 having a program dot array corresponding to each OTP-ROM cell array 21 provided in areas 12 to be a plurality of semiconductor chips arranged in a semiconductor wafer to the OTP-ROM cell array 21 in one of the areas to be the plurality of semiconductor chips 12; and programming the OTP-ROM cell array 21 with a different pattern for each of the areas to be the plurality of semiconductor chips 12 by using the program head 80.
Public/Granted literature
- US20080316790A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR MANUFACTURING DEVICE Public/Granted day:2008-12-25
Information query
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