Invention Grant
US08815659B2 Methods of forming a FinFET semiconductor device by performing an epitaxial growth process
有权
通过进行外延生长工艺来形成FinFET半导体器件的方法
- Patent Title: Methods of forming a FinFET semiconductor device by performing an epitaxial growth process
- Patent Title (中): 通过进行外延生长工艺来形成FinFET半导体器件的方法
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Application No.: US13716686Application Date: 2012-12-17
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Publication No.: US08815659B2Publication Date: 2014-08-26
- Inventor: Min-hwa Chi , Nam Sung Kim
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L29/66 ; H01L29/78

Abstract:
A method of forming a FinFET device involves performing an epitaxial growth process to form a layer of semiconducting material on a semiconducting substrate, wherein a first portion of the layer of semiconducting material will become a fin structure for the FinFET device and wherein a plurality of second portions of the layer of semiconducting material will become source/drain structures of the FinFET device, forming a gate insulation layer around at least a portion of the fin structure and forming a gate electrode above the gate insulation layer.
Public/Granted literature
- US20140167120A1 METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE BY PERFORMING AN EPITAXIAL GROWTH PROCESS Public/Granted day:2014-06-19
Information query
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