Invention Grant
US08815670B2 Preventing Fin erosion and limiting EPI overburden in FinFET structures by composite hardmask
有权
通过复合硬掩模防止鳍片侵蚀并限制FinFET结构中的EPI覆盖层
- Patent Title: Preventing Fin erosion and limiting EPI overburden in FinFET structures by composite hardmask
- Patent Title (中): 通过复合硬掩模防止鳍片侵蚀并限制FinFET结构中的EPI覆盖层
-
Application No.: US14017488Application Date: 2013-09-04
-
Publication No.: US08815670B2Publication Date: 2014-08-26
- Inventor: Veeraraghavan S. Basker , Effendi Leobandung , Tenko Yamashita , Chun-chen Yeh
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Harrington & Smith
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A FinFET structure is formed by forming a hardmask layer on a substrate including a silicon-containing layer on an insulating layer. The hardmask layer includes first, second and third layers on the silicon-containing layer. An array of fins is formed from the hardmask layer and the silicon-containing layer. A gate is formed covering a portion but not all of a length of each of the array of fins. The portion covers each of the fins in the array. The gate defines source/drain regions on either side of the gate. A spacer is formed on each side of the gate, the forming of the spacer performed to remove the third layer from portions of the fins in the source/drain regions. The second layer of the hardmask layer is removed from the portions of the fins in the source/drain regions, and the fins in the source/drain regions are merged.
Public/Granted literature
- US20140159167A1 PREVENTING FIN EROSION AND LIMITING EPI OVERBURDEN IN FINFET STRUCTURES BY COMPOSITE HARDMASK Public/Granted day:2014-06-12
Information query
IPC分类: