Invention Grant
- Patent Title: Manufacturing apparatus and method for semiconductor device and cleaning method of manufacturing apparatus for semiconductor
- Patent Title (中): 半导体装置的制造装置和方法以及半导体制造装置的清洗方法
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Application No.: US13160209Application Date: 2011-06-14
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Publication No.: US08815711B2Publication Date: 2014-08-26
- Inventor: Kunihiko Suzuki , Hideki Ito , Hidekazu Tsuchida , Isaho Kamata , Masahiko Ito
- Applicant: Kunihiko Suzuki , Hideki Ito , Hidekazu Tsuchida , Isaho Kamata , Masahiko Ito
- Applicant Address: JP Numazu-shi, Shizuoka-ken JP Kariya, Aichi-Pref. JP Toyota-shi, Aichi-ken
- Assignee: NuFlare Technology, Inc.,Denso Corporation,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: NuFlare Technology, Inc.,Denso Corporation,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Numazu-shi, Shizuoka-ken JP Kariya, Aichi-Pref. JP Toyota-shi, Aichi-ken
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2010-141419 20100622; JP2011-100478 20110428
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L21/31 ; H01L21/469 ; B08B17/02 ; H01L21/67 ; C23C16/44 ; H01L21/205
Abstract:
A manufacturing apparatus for a semiconductor device, including: a reaction chamber configured to perform film formation on a wafer; a process gas supplying mechanism provided in an upper part of the reaction chamber and configured to introduce process gas to an interior of the reaction chamber; a gas discharging mechanism provided in a lower part of the reaction chamber and configured to discharge gas from the reaction chamber; a supporting member configured to hold the wafer; a cleaning gas supplying mechanism provided in an outer periphery of the supporting member and configured to emit cleaning gas in an outer periphery direction below an upper end of the supporting member; a heater configured to heat the wafer; and a rotary driving mechanism configured to rotate the wafer.
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