Through substrate via semiconductor components and methods of formation thereof

Invention Grant

US08815743B2 Through substrate via semiconductor components and methods of formation thereof 有权

Title translation: 通过半导体元件的基板及其形成方法

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Patent Title: Through substrate via semiconductor components and methods of formation thereof
Patent Title (中): 通过半导体元件的基板及其形成方法
Application No.: US13830185

Application Date: 2013-03-14
Publication No.: US08815743B2

Publication Date: 2014-08-26
Inventor: Albert Birner , Uwe Hoeckele , Thomas Kunstmann , Uwe Seidel
Applicant: Infineon Technologies AG
Applicant Address: DE Neubiberg
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Neubiberg
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L21/311
IPC: H01L21/311

Through substrate via semiconductor components and methods of formation thereof

Abstract:

A structure and method of forming through substrate vias in forming semiconductor components are described. In one embodiment, the invention describes a method of forming the through substrate via by filling an opening with a first fill material and depositing a first insulating layer over the first fill material, the first insulating layer not being deposited on sidewalls of the fill material in the opening, wherein sidewalls of the first insulating layer form a gap over the opening. The method further includes forming a void by sealing the opening using a second insulating layer.

Abstract(Chinese):

描述了在形成半导体部件时通过衬底通孔形成的结构和方法。在一个实施例中，本发明描述了一种通过用第一填充材料填充开口形成通孔基底通孔的方法，并且在第一填充材料上沉积第一绝缘层，第一绝缘层不被沉积在填充材料的侧壁上所述开口，其中所述第一绝缘层的侧壁在所述开口上形成间隙。该方法还包括通过使用第二绝缘层密封开口来形成空隙。

Public/Granted literature

US20130267093A1 Through Substrate Via Semiconductor Components And Methods of Formation Thereof Public/Granted day:2013-10-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理
H01L21/311	.......绝缘层的刻蚀