Invention Grant
- Patent Title: Method for manufacturing a barrier layer on a substrate and a multi-layer stack
- Patent Title (中): 在基板和多层叠层上制造阻挡层的方法
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Application No.: US13811326Application Date: 2011-07-12
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Publication No.: US08815749B2Publication Date: 2014-08-26
- Inventor: Hindrik De Vries
- Applicant: Hindrik De Vries
- Applicant Address: NL
- Assignee: Fujifilm Manufacturing Europe B.V.
- Current Assignee: Fujifilm Manufacturing Europe B.V.
- Current Assignee Address: NL
- Agency: Banner & Witcoff, Ltd.
- Priority: GB1012225.7 20100721
- International Application: PCT/GB2011/051305 WO 20110712
- International Announcement: WO2012/010866 WO 20120126
- Main IPC: H01L21/31
- IPC: H01L21/31
Abstract:
A method for manufacturing a barrier layer (14) on a flexible substrate (6a, 6b), comprising depositing an inorganic layer on the substrate in a treatment space (5), the treatment space (5) being formed between at least two electrodes (2, 3) for generating an atmospheric pressure glow discharge plasma. The barrier layer (14) is characterized in that it is formed by three subsequent depositions of inorganic layers on the substrate (6a, 6b), each layer being at most 150 nm in thickness.
Public/Granted literature
- US20130178060A1 Method for Manufacturing a Barrier Layer on a Substrate and a Multi-Layer Stack Public/Granted day:2013-07-11
Information query
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