Invention Grant
- Patent Title: Polymeric compositions and related methods of use
- Patent Title (中): 聚合物组合物和相关使用方法
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Application No.: US11068298Application Date: 2005-02-28
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Publication No.: US08815793B2Publication Date: 2014-08-26
- Inventor: Phillip B. Messersmith , Jeffrey Dalsin , Lijun Lin , Bruce P. Lee , Kul Huang
- Applicant: Phillip B. Messersmith , Jeffrey Dalsin , Lijun Lin , Bruce P. Lee , Kul Huang
- Applicant Address: US IL Evanston
- Assignee: Northwestern University
- Current Assignee: Northwestern University
- Current Assignee Address: US IL Evanston
- Agency: Quarles & Brady, LLP
- Main IPC: A61K38/00
- IPC: A61K38/00 ; C08L89/02
Abstract:
Adhesive polymeric compositions which can comprise dihydroxyphenyl moieties and derivatives thereof, and related methods of use.
Public/Granted literature
- US20050288398A1 Polymeric compositions and related methods of use Public/Granted day:2005-12-29
Information query
IPC分类:
