Invention Grant
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
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Application No.: US12526751Application Date: 2008-02-13
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Publication No.: US08815985B2Publication Date: 2014-08-26
- Inventor: Katsuyu Wakabayashi , Katsuya Ouchi
- Applicant: Katsuyu Wakabayashi , Katsuya Ouchi
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-032074 20070213
- International Application: PCT/JP2008/052370 WO 20080213
- International Announcement: WO2008/099858 WO 20080821
- Main IPC: C08K5/34
- IPC: C08K5/34 ; C08K5/16 ; C08K5/00 ; C08K5/24

Abstract:
An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.
Public/Granted literature
- US20100152373A1 CURABLE COMPOSITION Public/Granted day:2010-06-17
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