Invention Grant
US08816217B2 Polyimides and fluoropolymer bonding layer with improved copper heat seal strength 有权
聚酰亚胺和氟聚合物粘合层具有提高的铜热封强度

Polyimides and fluoropolymer bonding layer with improved copper heat seal strength
Abstract:
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described.
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