Invention Grant
US08816217B2 Polyimides and fluoropolymer bonding layer with improved copper heat seal strength
有权
聚酰亚胺和氟聚合物粘合层具有提高的铜热封强度
- Patent Title: Polyimides and fluoropolymer bonding layer with improved copper heat seal strength
- Patent Title (中): 聚酰亚胺和氟聚合物粘合层具有提高的铜热封强度
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Application No.: US13392942Application Date: 2010-08-31
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Publication No.: US08816217B2Publication Date: 2014-08-26
- Inventor: Haibin Zheng , Gregory Douglas Clements , Blair Gordon Jones , Manish Maheshwari , Toshinori Mizuguchi
- Applicant: Haibin Zheng , Gregory Douglas Clements , Blair Gordon Jones , Manish Maheshwari , Toshinori Mizuguchi
- Applicant Address: US TX Pasadena
- Assignee: Kaneka North America LLC
- Current Assignee: Kaneka North America LLC
- Current Assignee Address: US TX Pasadena
- Agency: Kagan Binder, PLLC
- International Application: PCT/US2010/047233 WO 20100831
- International Announcement: WO2011/028679 WO 20110310
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described.
Public/Granted literature
- US20120152591A1 POLYIMIDES AND FLUOROPOLYMER BONDING LAYER WITH IMPROVED COPPER HEAT SEAL STRENGTH Public/Granted day:2012-06-21
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