Invention Grant
US08816219B2 Metal strip assembly for EMI shield case, EMI shield case including the same, and fabrication method of the case
有权
用于EMI屏蔽外壳的金属条组件，包括EMI屏蔽外壳以及其制造方法
- Patent Title: Metal strip assembly for EMI shield case, EMI shield case including the same, and fabrication method of the case
- Patent Title (中): 用于EMI屏蔽外壳的金属条组件，包括EMI屏蔽外壳以及其制造方法
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Application No.: US13473098Application Date: 2012-05-16
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Publication No.: US08816219B2Publication Date: 2014-08-26
- Inventor: Sun-Ki Kim
- Applicant: Sun-Ki Kim
- Applicant Address: KR KR
- Assignee: Joinset Co. Ltd.,Sun-Ki Kim
- Current Assignee: Joinset Co. Ltd.,Sun-Ki Kim
- Current Assignee Address: KR KR
- Agency: Locke Lord LLP
- Agent Alan B. Clement; Peter J. Fallon
- Priority: KR10-2011-0065993 20110704
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
Provided is a metal strip for an electromagnetic interference shield case. The metal strip is uniform in width and thickness. A metal clip that is integrated with at least one pair of face-to-face elastic parts and is appropriate for soldering is fitted on an end of the metal strip along a width direction of the metal strip. The metal strip is bent and cut so as to have a shape corresponding to a ground pattern disposed on a printed circuit board, and then, a bottom surface of the metal clip is soldered to the ground pattern or a solder member disposed on the ground pattern.
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