Invention Grant
- Patent Title: Enclosure cooling apparatus
- Patent Title (中): 外壳冷却装置
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Application No.: US13016505Application Date: 2011-01-28
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Publication No.: US08816220B2Publication Date: 2014-08-26
- Inventor: Daniel P. Jones
- Applicant: Daniel P. Jones
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Burns & Levinson LLP
- Agent Joseph M. Maraia
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An enclosure that includes a box structure that includes a plurality of sides defining a sealed chamber for containing a heat producing component. At least one of the sides of the box structure includes a panel. The panel includes two outer sheets and an inner layer of material sandwiched between the two outer sheets. The two outer sheets and the inner layer of material collectively define a plurality of fluid flow channels extending from a first end of the two outer sheets to a second end of the two outer sheets. Heat generated by the heat producing component is transferred to at least one of the outer sheets which transfers the heat to fluid flowing through the fluid flow channels. The panel can be the main load bearing path of the box structure.
Public/Granted literature
- US20120193138A1 ENCLOSURE COOLING APPARATUS Public/Granted day:2012-08-02
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