Invention Grant
- Patent Title: Low electrical resistance bond
- Patent Title (中): 低电阻键
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Application No.: US13408081Application Date: 2012-02-29
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Publication No.: US08816221B2Publication Date: 2014-08-26
- Inventor: Nathan A. Berry , Aaron M. Finke , Eric A. Carter
- Applicant: Nathan A. Berry , Aaron M. Finke , Eric A. Carter
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US CT Windsor Locks
- Agency: Kinney & Lange, P.A.
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01B5/00 ; F16K27/00
Abstract:
A low resistance pathway includes a flexible member, a surface interfacing the flexible member, a sealing feature, and a fastener. The sealing feature forms an interior edge of at least one of the flexible member and the surface. The fastener compresses the flexible member to contact the surface.
Public/Granted literature
- US20130220668A1 LOW ELECTRICAL RESISTANCE BOND Public/Granted day:2013-08-29
Information query
