Invention Grant
- Patent Title: Method of cutting object to be processed
- Patent Title (中): 切割待处理物体的方法
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Application No.: US13107056Application Date: 2011-05-13
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Publication No.: US08816245B2Publication Date: 2014-08-26
- Inventor: Hiroyuki Iwaki , Takafumi Ogiwara , Takeshi Sakamoto , Masaharu Hoshikawa , Kazuhiro Atsumi , Daisuke Kawaguchi
- Applicant: Hiroyuki Iwaki , Takafumi Ogiwara , Takeshi Sakamoto , Masaharu Hoshikawa , Kazuhiro Atsumi , Daisuke Kawaguchi
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-112188 20100514
- Main IPC: B23K26/40
- IPC: B23K26/40

Abstract:
A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.
Public/Granted literature
- US20110309060A1 METHOD OF CUTTING OBJECT TO BE PROCESSED Public/Granted day:2011-12-22
Information query
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