Invention Grant
- Patent Title: Pattern evaluation method, device therefor, and electron beam device
- Patent Title (中): 图案评估方法,装置和电子束装置
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Application No.: US13386540Application Date: 2010-07-26
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Publication No.: US08816277B2Publication Date: 2014-08-26
- Inventor: Hiromasa Yamanashi , Yasunari Sohda , Takeyoshi Ohashi , Muneyuki Fukuda
- Applicant: Yasunari Sohda , Takeyoshi Ohashi , Muneyuki Fukuda , Toru Yamanashi
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2009-174315 20090727; JP2009-185845 20090810
- International Application: PCT/JP2010/004743 WO 20100726
- International Announcement: WO2011/013342 WO 20110203
- Main IPC: G01N23/04
- IPC: G01N23/04 ; G01N23/00

Abstract:
An amount of pattern position displacement between observation images acquired by irradiating from two different directions is changed depending on beam deflection for moving an image acquisition position. In a pattern evaluation method that measures astigmatic difference or focus position displacement having a small amount of dose at a high speed using parallax caused by the tilted beam, a correction value obtained in advance by measurement is reflected in an amount of pattern position displacement between observation images obtained by irradiating from at least two different directions and generated in accordance with the amount of beam deflection for moving an image acquisition position. A processing unit calculates an amount of correction of an amount of pattern position displacement depending on beam deflection of a beam deflecting unit for moving an image acquisition position on the sample at a high speed.
Public/Granted literature
- US20130026361A1 PATTERN EVALUATION METHOD, DEVICE THEREFOR, AND ELECTRON BEAM DEVICE Public/Granted day:2013-01-31
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