Invention Grant
- Patent Title: Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device
- Patent Title (中): 密封体，密封体的制造方法，发光装置以及发光装置的制造方法
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Application No.: US13523435Application Date: 2012-06-14
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Publication No.: US08816336B2Publication Date: 2014-08-26
- Inventor: Akihisa Shimomura
- Applicant: Akihisa Shimomura
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2011-133957 20110616
- Main IPC: H01L29/08
- IPC: H01L29/08
Abstract:
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.
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