Invention Grant
- Patent Title: Semiconductor light emitting device and method for manufacturing same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US13727147Application Date: 2012-12-26
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Publication No.: US08816367B2Publication Date: 2014-08-26
- Inventor: Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
- Applicant: Jumpei Tajima , Kotaro Zaima , Hiroshi Ono , Shinji Yamada , Shigeya Kimura , Naoharu Sugiyama , Shinya Nunoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-132221 20120611
- Main IPC: H01L33/22
- IPC: H01L33/22

Abstract:
According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first and second semiconductor layers and a light emitting layer. The first electrode includes a first region, a second region, and a third region provided between them. The first semiconductor layer includes a first portion on the first region and a second portion on the second region. The light emitting layer includes a third portion on the first portion and a fourth portion on the second portion. The second semiconductor layer includes a fifth portion on the third portion and a sixth portion on the fourth portion. The insulating layer is provided between the first and second portions on the third region and between the third and fourth portions. The second electrode includes a seventh portion provided on the insulating layer, eighth and ninth portions contacting side surfaces of the fifth and sixth portions.
Public/Granted literature
- US20130328075A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-12-12
Information query
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