Invention Grant
US08816372B2 LED package having a covering portion made of silicon-titanate resin for sealing a joint and method for making the same
有权
LED封装具有由用于密封接头的硅酸钛树脂制成的覆盖部分及其制造方法
- Patent Title: LED package having a covering portion made of silicon-titanate resin for sealing a joint and method for making the same
- Patent Title (中): LED封装具有由用于密封接头的硅酸钛树脂制成的覆盖部分及其制造方法
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Application No.: US13337125Application Date: 2011-12-25
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Publication No.: US08816372B2Publication Date: 2014-08-26
- Inventor: Chia-Chiang Yang , Wen-Liang Tseng
- Applicant: Chia-Chiang Yang , Wen-Liang Tseng
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110145798 20110601
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allyltrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.
Public/Granted literature
- US20120305960A1 LED PACKAGE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-12-06
Information query
IPC分类:
