Invention Grant
US08816390B2 System and method for an electronic package with a fail-open mechanism
有权
具有故障切换机制的电子封装的系统和方法
- Patent Title: System and method for an electronic package with a fail-open mechanism
- Patent Title (中): 具有故障切换机制的电子封装的系统和方法
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Application No.: US13361742Application Date: 2012-01-30
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Publication No.: US08816390B2Publication Date: 2014-08-26
- Inventor: Carlo Baterna Marbella , Ganesh Vetrivel Periasamy , Kok Kiat Koo , Ai Min Tan
- Applicant: Carlo Baterna Marbella , Ganesh Vetrivel Periasamy , Kok Kiat Koo , Ai Min Tan
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L21/52 ; H01L23/373
Abstract:
In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
Public/Granted literature
- US20130194752A1 SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM Public/Granted day:2013-08-01
Information query
