Invention Grant
- Patent Title: E-mode high electron mobility transistor and method of manufacturing the same
- Patent Title (中): E型高电子迁移率晶体管及其制造方法
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Application No.: US13222322Application Date: 2011-08-31
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Publication No.: US08816396B2Publication Date: 2014-08-26
- Inventor: In-jun Hwang , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong , Jai-kwang Shin , Jae-joon Oh
- Applicant: In-jun Hwang , Jong-seob Kim , Hyuk-soon Choi , Ki-ha Hong , Jai-kwang Shin , Jae-joon Oh
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0098995 20101011
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
According to an example embodiment, a high electron mobility transistor (HEMT) includes a substrate, a buffer layer on the substrate, a channel layer on the buffer layer, and a barrier structure on the channel layer. The buffer layer includes a 2-dimensional electron gas (2DEG). A polarization of the barrier structure varies in a region corresponding to a gate electrode. The HEMT further includes and the gate electrode, a source electrode, and a drain electrode on the barrier structure.
Public/Granted literature
- US20120086049A1 E-Mode High Electron Mobility Transistor And Method Of Manufacturing The Same Public/Granted day:2012-04-12
Information query
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