Invention Grant
US08816400B2 SiGe HBT having deep pseudo buried layer and manufacturing method thereof
有权
具有深伪埋层的SiGe HBT及其制造方法
- Patent Title: SiGe HBT having deep pseudo buried layer and manufacturing method thereof
- Patent Title (中): 具有深伪埋层的SiGe HBT及其制造方法
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Application No.: US13671587Application Date: 2012-11-08
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Publication No.: US08816400B2Publication Date: 2014-08-26
- Inventor: Wensheng Qian
- Applicant: Shanghai Hua Hong Nec Electronics Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong Nec Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong Nec Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: MKG, LLC
- Priority: CN201110350565 20111108
- Main IPC: H01L29/737
- IPC: H01L29/737

Abstract:
A silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) having a deep pseudo buried layer is disclosed. The SiGe HBT includes isolation structures formed in trenches, first pseudo buried layers and second pseudo buried layers, and a collector region. The first pseudo buried layers are formed under the respective trenches and the second pseudo buried layers are formed under the first pseudo buried layers, with each first pseudo buried layer vertically contacting with a second pseudo buried layer. The second pseudo buried layers are laterally connected to each other, and the collector region is surrounded by the trenches, the first pseudo buried layers and the second pseudo buried layers. The cross section of each of the trenches has a regular trapezoidal shape, namely, each trench's width of its top is smaller than that of its bottom. A manufacturing method of the SiGe HBT is also disclosed.
Public/Granted literature
- US20130113021A1 SIGE HBT HAVING DEEP PSEUDO BURIED LAYER AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-09
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