Invention Grant
- Patent Title: Module structure with partial pierced substrate
- Patent Title (中): 模块结构与部分穿孔基板
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Application No.: US13669055Application Date: 2012-11-05
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Publication No.: US08816414B2Publication Date: 2014-08-26
- Inventor: Shin-Dar Jan
- Applicant: LarView Technologies Corporation
- Applicant Address: TW Yangmei, Taoyuan County
- Assignee: LarView Technologies Corporation
- Current Assignee: LarView Technologies Corporation
- Current Assignee Address: TW Yangmei, Taoyuan County
- Agency: Huntington IP Consulting Co., Ltd
- Agent Chih Feng Yeh
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L31/0232

Abstract:
The present invention provides a module structure comprising a substrate with a partial pierced region. A main chip has a sensing area. At least one component is included, wherein the main chip, the at least one component and the substrate are located at the same level. A holder is disposed on the substrate. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.
Public/Granted literature
- US20140124887A1 Module Structure with Partial Pierced Substrate Public/Granted day:2014-05-08
Information query
IPC分类: