Invention Grant
- Patent Title: All around gate type semiconductor device and method of manufacturing the same
- Patent Title (中): 所有围栅型半导体器件及其制造方法
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Application No.: US12266453Application Date: 2008-11-06
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Publication No.: US08816427B2Publication Date: 2014-08-26
- Inventor: Tae Su Jang
- Applicant: Tae Su Jang
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2008-0072824 20080725
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An all around gate type semiconductor device improves mobility of electrons and holes by using a silicon germanium pillar and a silicon layer surrounding the silicon germanium pillar as a vertical channel. A gate electrode is formed to surround the vertical channel. When a semiconductor device is used as a nMOSFET, the silicon layer strained by silicon germanium is used as the channel to increase electron mobility. When the semiconductor device is used as a pMOSFET, the silicon germanium pillar is used as the channel to increase hole mobility. Thus, the semiconductor device can enhance current supply capacity regardless of transistor type.
Public/Granted literature
- US20100019276A1 ALL AROUND GATE TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-01-28
Information query
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