Invention Grant
US08816427B2 All around gate type semiconductor device and method of manufacturing the same 有权
所有围栅型半导体器件及其制造方法

  • Patent Title: All around gate type semiconductor device and method of manufacturing the same
  • Patent Title (中): 所有围栅型半导体器件及其制造方法
  • Application No.: US12266453
    Application Date: 2008-11-06
  • Publication No.: US08816427B2
    Publication Date: 2014-08-26
  • Inventor: Tae Su Jang
  • Applicant: Tae Su Jang
  • Applicant Address: KR Icheon-si
  • Assignee: SK hynix Inc.
  • Current Assignee: SK hynix Inc.
  • Current Assignee Address: KR Icheon-si
  • Agency: Kilpatrick Townsend & Stockton LLP
  • Priority: KR10-2008-0072824 20080725
  • Main IPC: H01L29/66
  • IPC: H01L29/66
All around gate type semiconductor device and method of manufacturing the same
Abstract:
An all around gate type semiconductor device improves mobility of electrons and holes by using a silicon germanium pillar and a silicon layer surrounding the silicon germanium pillar as a vertical channel. A gate electrode is formed to surround the vertical channel. When a semiconductor device is used as a nMOSFET, the silicon layer strained by silicon germanium is used as the channel to increase electron mobility. When the semiconductor device is used as a pMOSFET, the silicon germanium pillar is used as the channel to increase hole mobility. Thus, the semiconductor device can enhance current supply capacity regardless of transistor type.
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