Invention Grant
- Patent Title: MEMS structure and manufacturing method thereof
- Patent Title (中): MEMS结构及其制造方法
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Application No.: US13035186Application Date: 2011-02-25
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Publication No.: US08816451B2Publication Date: 2014-08-26
- Inventor: Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
- Applicant: Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
- Applicant Address: JP Aichi
- Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
- Current Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
- Current Assignee Address: JP Aichi
- Agency: Oliff PLC
- Priority: JP2010-046496 20100303
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/02

Abstract:
In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.
Public/Granted literature
- US20110215428A1 MEMS STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-09-08
Information query
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