Invention Grant
US08816453B2 MEMS component and a semiconductor component in a common housing having at least one access opening
有权
MEMS部件和共用壳体中的半导体部件具有至少一个进入开口
- Patent Title: MEMS component and a semiconductor component in a common housing having at least one access opening
- Patent Title (中): MEMS部件和共用壳体中的半导体部件具有至少一个进入开口
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Application No.: US13454911Application Date: 2012-04-24
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Publication No.: US08816453B2Publication Date: 2014-08-26
- Inventor: Jochen Zoellin , Ricardo Ehrenpfordt , Ulrike Scholz
- Applicant: Jochen Zoellin , Ricardo Ehrenpfordt , Ulrike Scholz
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102011075260 20110504
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; B81B3/00 ; B81B7/02 ; H01L25/16 ; H04R19/04 ; B81C1/00 ; H01L23/00
Abstract:
A component includes at least one MEMS component and at least one additional semiconductor component in a common housing having at least one access opening. On the front side of the MEMS component, at least one diaphragm structure is provided, which spans a cavity on the backside of the MEMS component. The housing includes a carrier, on which the MEMS component is mounted. The MEMS component is mounted, using its front side, on the carrier, so that there is a standoff between the diaphragm structure and the carrier surface. The at least one additional semiconductor component is connected to the backside of the MEMS component, so that the MEMS component and the semiconductor component form a chip stack.
Public/Granted literature
- US20120280335A1 COMPONENT Public/Granted day:2012-11-08
Information query
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