Invention Grant
US08816476B2 Through silicon via processing techniques for lateral double-diffused MOSFETS
有权
通过用于横向双扩散MOSFET的硅经处理技术
- Patent Title: Through silicon via processing techniques for lateral double-diffused MOSFETS
- Patent Title (中): 通过用于横向双扩散MOSFET的硅经处理技术
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Application No.: US13095539Application Date: 2011-04-27
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Publication No.: US08816476B2Publication Date: 2014-08-26
- Inventor: Shekar Mallikarjunaswamy
- Applicant: Shekar Mallikarjunaswamy
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor Corporation
- Current Assignee: Alpha & Omega Semiconductor Corporation
- Current Assignee Address: US CA Sunnyvale
- Agent Kenneth C. Brooks
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/417 ; H01L21/74 ; H01L29/78 ; H01L21/768 ; H01L29/66 ; H01L29/08 ; H01L23/495 ; H01L29/45 ; H01L29/10 ; H01L29/06

Abstract:
The present invention features a field effect transistor forming on a semiconductor substrate having formed thereon gate, source and drain regions, with said gate region having a lateral gate channel. A plurality of spaced-apart trenches each having an electrically conductive plug formed therein in electrical communication with said gate, source and drain regions, with said trenches extend from a back surface of said semiconductor substrate to a controlled depth. A trench contact shorts the source region and a body region. A source contact is in electrical communication with said source region and a drain contact in electrical communication with said drain region, with said source and drain contacts being disposed on opposite sides of said gate channel.
Public/Granted literature
- US20120273878A1 THROUGH SILICON VIA PROCESSING TECHNIQUES FOR LATERAL DOUBLE-DIFFUSED MOSFETS Public/Granted day:2012-11-01
Information query
IPC分类: